It will debut its new LogicFolding architecture in the upcoming Kirin 2026 smartphone processor.1.4nm HUAWEI chips soon?Countering trade restrictionsHUAWEI is rolling out high-end chips amid efforts to counter US sanctions blocking China’s access to advanced semiconductor manufacturing.Image from HUAWEIAccording to the company, the chips will feature a transistor density that is equivalent to 14 Å (1.4 nm) processes. This will be implemented by 2031.Based on HUAWEI’s Tau (τ) Scaling Law, innovative LogicFolding technologies will be first implemented in the upcoming HUAWEI Kirin 2026, and subsequently help high-end HUAWEI chips achieve a groundbreaking transistor density equivalent to 14 Å (1.4 nm) processes by 2031, the company said.A Reuters report quoted HUAWEI, noting that the Tau Scaling Law focuses on cutting the…Read More
HUAWEI targets 1.4nm equivalent chip density by 2031 using LogicFolding
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