TECNO Reveals Ultra-Slim Modular Smartphone Concept

TECNO Reveals Ultra-Slim Modular Smartphone Concept

|

TECNO has unveiled a groundbreaking modular smartphone concept. Measuring at 4.9mm in thickness, the device introduces a sophisticated “Modular Magnetic Interconnection” system that allows users to hot-swap hardware components with ease. TECNO Ultra-slim Modular Phone TECNO’s approach focuses on a sleek, integrated aesthetic. The phone’s matte-glass back is divided into eight zones that guide theRead More

Share This Post:

Leave a Comment