Xiaomi has given the first public look at the Xiaomi 18 Fold at IFA 2026 in Berlin, confirming that its upcoming foldable flagship will be the first Xiaomi smartphone to use the company’s new in-house XRING O3 chip. Xiaomi says the processor will help power AI features across its ecosystem. The Xiaomi 18 Fold marks another step in Xiaomi’s push to develop its own silicon for flagship devices. The company introduced its latest XRING chips at IFA 2026 as part of its broader AI strategy, with the XRING O3 positioned as the processor for its next-generation flagship products.Xiaomi says its in-house XRING chips will help power AI across its complete ecosystem. The approach puts more of the underlying hardware and… Read More
Xiaomi 18 Fold debuts at IFA 2026 with new XRING O3 chip
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