Xiaomi just revealed the Xiaomi 18 Fold and the Xiaomi Pad 9 Pro Max, both powered by the new in-house Xiaomi XRING O3 system-on-chip. Built on an advanced 3nm process with 24 billion transistors, the flagship chip pairs a 10-core CPU with a 16-core G2-Ultra NX GPU, delivering up to 60 percent higher CPU performance and 85 percent faster graphics. The platform also incorporates a quad-core NPU that provides 200 TOPS of tensor performance and boosts on-device decoding by 45 percent. Debuting as Xiaomi’s first mid-size foldable smartphone, the Xiaomi 18 Fold folds down to passport size with a 5.38-inch outer screen and opens to an expansive 7.58-inch main display. Weighing 219 grams and measuring 5.02 millimeters thin when unfolded,… Read More
Xiaomi unveils Xiaomi 18 Fold featuring XRING O3
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