Xiaomi unveils XRING O3: world’s first 3nm mobile processor supporting next-gen LPDDR6 memory

Xiaomi introduced its new XRING 03, the world’s first 3nm chip to support LPDDR6 Memory.Xiaomi XRING O3 launchesThe chip will debut in Xiaomi’s next foldable!Its introduction at the Xiaomi XRING Chip Technology Communications Conference signals that the Chinese company intends to compete at the highest level of chip design. The brand also said that the chip will debut on the Xiaomi 18 Fold.Xiaomi XRING O3 to debut on the upcoming Xiaomi 18 Fold next monthIt is built on a die size of 133 mm²; the XRING O3 houses over 24 billion transistors, a 26 percent increase in transistor density compared to its predecessor, the XRING O2.The standout technical achievement of the XRING O3 is its memory interface integration. As the…Read More